In alignment with the National Semiconductor Strategic Plan (NSS), the development of local talent is a key pillar in driving the growth of the Electrical & Electronics (E&E) industry, with a particular focus on semiconductor technology. To meet the projected industry demand, the NSS targets the training of 60,000 engineers. In support of this objective, the Engineering Talent for Semiconductor Industry (ETSI) program has been established as a strategic talent development initiative to facilitate the effective implementation of the NSS.

CREST Open DayETSI Sharing Session23 June 2026Auditorium Murad, sains@USM, Bukit Jambul |

Advanced Packaging TrainingsPenangETSI for Current WorkforceJuly & August 2026 |

ETSI Trainingsfor National Training Week (NTW)20th till 24th July 2026 |
The Engineering Talent for Semiconductor Industry (ETSI) program is strategically designed to build and sustain a robust talent pipeline that meets the evolving demands of the global semiconductor ecosystem. The program focuses on four key pillars:
ETSI enhances workforce capabilities through targeted upskilling and reskilling programs in key semiconductor areas, ensuring employees remain competitive amid rapid technological change.
In collaboration with tertiary institutions, ETSI embeds industry-relevant curricula and offers early exposure through internships, projects, and technical training to boost graduate readiness for the semiconductor sector.
ETSI supports innovation by engaging postgraduate students in industry-driven research and placements, bridging academic learning with practical development.
CREST Semiconductor Center of Excellence (CoE) facilitates new technology adoption and knowledge sharing through advanced tools and infrastructure for talent development and R&D collaboration.
Upskilling and reskilling existing professionals to stay aligned with evolving semiconductor technologies and global industry demands.
Equipping fresh graduates and unemployed individuals with industry-relevant skills to enhance employability and readiness for entry into the semiconductor workforce.
Nurturing and upskilling future talent through structured internship programs to build a sustainable talent pipeline for the semiconductor industry.
Providing infrastructure, tools and equipment to support high-impact talent development and training programs under ETSI.
Early intervention program for tertiary education institutions students, to attract and nurture industry relevant graduates for semiconductor industry
Upgrading the technical capabilities of education institutions to develop industry relevant graduates for semiconductor industry and in general, E&E industry.
Promoting interest and passion in STEM among primary and high school students.
Note: The technology and training focus areas may be expanded in the future to align with evolving semiconductor industry needs.
| No. | Requirements | Details |
|---|---|---|
| 1. | Eligible Applicants | Semiconductor companies operating in Malaysia, with specialisation in the following technologies:
|
| 2. | Eligible Training Participants |
|
| 3. | Training Structure |
|
| 4. | HRD Corp Claimable |
|
| No. | Technology Areas | Training Focus Areas |
|---|---|---|
| 1. | IC Design |
|
| 2. | Advanced Packaging |
|
| 3. | Wafer Fabrication |
|
| 4. | Embedded Systems |
|
| 5. | Process Automation |
|
| No. | Training Topic |
|---|---|
| IC Design & Embedded Systems | |
| 1. | Systems Verification with SystemVerilog |
| 2. | Systems Design Optimization with SystemVerilog |
| 3. | Systems Design with High-level Synthesis |
| 4. | Chip Layout: Partitioning & Floorplanning Automation |
| 5. | Chip Layout: Placement & Routing (I) Automation |
| 6. | Chip Layout: Routing (II) Automation to Timing Closure |
| 7. | Instruction Set Extension and Datapath Design |
| 8. | Memory Architecture |
| 9. | Contemporary Computer Architecture |
| 10. | Introduction to Modern Embedded System |
| 11. | ARM Architecture & Programming – Part 1 |
| 12. | ARM Architecture & Programming – Part 2 |
| 13. | Digital Circuit Modeling Using Hardware Description Language |
| 14. | Register-Transfer Level Modeling of Sequential Circuits |
| 15. | Register-Transfer Level Modeling of Complex Sequential Circuits |
| 16. | Semiconductor Junction Devices and Electrical Behavior |
| 17. | Metal–Oxide–Semiconductor Field-Effect Transistor (MOSFET) Principles and Operation |
| 18. | Advanced MOSFET Technologies and Nonideal Effects |
| 19. | Analog CMOS Integrated Circuit Design: Fundamentals |
| 20. | Analog CMOS Integrated Circuit Design: Basic Amplifier Circuits |
| 21. | Analog CMOS Integrated Circuit Design: Op-Amp Circuits |
| 22. | VLSI Circuits and Design Part 1: Modeling MOSFET and CMOS Inverter |
| 23. | VLSI Circuits and Design Part 2: Design of CMOS Digital Logic Circuits |
| 24. | VLSI Circuits and Design Part 3: Optimization of CMOS Digital Logic Circuits |
| 25. | Modeling Testing for Digital Circuit |
| 26. | Test Generation for Digital Circuit |
| 27. | Design for Testability Method for Digital Circuit |
| Process Automation | |
| 1. | Fundamental of Machine Learning |
| 2. | The Language of Machines: Neural Networks Meet NLP |
| 3. | Intelligent Optimization |
| 4. | Modelling of Linear and Non-Linear Systems |
| 5. | Simulation and Analyses of Control Systems |
| 6. | Feedback and Digital Control Systems |
| 7. | Introduction to Embedded Control System |
| 8. | Embedded Control System Design and Application |
| 9. | Advance Embedded Control System |
| 10. | Advanced Instrumentation Technology |
| 11. | Sensor System and IoT Integration |
| 12. | Safety Instrumented System for Industries |
| 13. | Python Framework for Deep Learning |
| 14. | Deep Learning: Mastering Neural Networks |
| 15. | Advanced Architecture Design for Deep Learning |
| 16. | Fundamentals in Computer Vision |
| 17. | Object Detection and Recognition |
| 18. | AI-based Image Enhancement – Segmentation |
| 19. | Design Sprint: From Idea to Engineering Blueprint |
| 20. | Smart Prototyping: Design, Test, Repeat! |
| 21. | Build & Connect: Engineering System Integration |
| 22. | Foundations of Mobile Robot Intelligence: Cybernetics and Behavior-Based Control |
| 23. | Locomotion and Motion Planning: Kinematics and Dynamics of Mobile Robots |
| 24. | Perception and Mapping: Sensor Fusion for Autonomous Navigation |
| Advanced Packaging | |
| 1. | Introduction to Advanced Packaging Techniques: 2.5D, 3D, Chiplets and Integration Technologies |
| 2. | CoWoS Technology for AI Systems and HPC Packaging Integration |
| 3. | Advanced Packaging Thermal Management for 2.5D and HPC Applications |
| 4. | Advanced Packaging Reliability and Failure Mode |
For training quotation and enquiries, please email training@crest.my
Exclusive Discounts for CREST Members
SME Members: 10% Discount
Non-SME Members: 8% Discount
| No. | Training Topic | Mode | Venue | Training Date | Brochure |
|---|---|---|---|---|---|
| Advanced Packaging | |||||
| 1. | Introduction to Advanced Packaging Techniques: 2.5D, 3D, Chiplets and Integration Technologies | Physical
(2 days) |
Penang | 27th & 28th July | |
| 2. | CoWoS Technology for AI Systems and HPC Packaging Integration | Physical
(1 day) |
Penang | 29th July | |
| 3. | Advanced Packaging Thermal Management for 2.5D and HPC Applications | Physical
(1 day) |
Penang | 30th July | |
| 4. | Advanced Packaging Reliability and Failure Mode | Physical
(1 day) |
Penang | 3rd August | |
| 5. | Introduction to Advanced Packaging Techniques: 2.5D, 3D, Chiplets and Integration Technologies | Online
(2 days) |
Online | 28th & 29th July | |
| 6. | CoWoS Technology for AI Systems and HPC Packaging Integration | Online
(1 day) |
Online | 30th July | |
| 7. | Advanced Packaging Thermal Management for 2.5D and HPC Applications | Online
(1 day) |
Online | 3rd August | |
| 8. | Advanced Packaging Reliability and Failure Mode | Online
(1 day) |
Online | 10th August | |
| IC Design & Embedded Systems | |||||
| 1. | Systems Verification with SystemVerilog | Physical
(2 days) |
Penang | 22nd & 23rd July | |
| 2. | Systems Design Optimization with SystemVerilog | Physical
(2 days) |
Penang | 27th & 28th July | |
| 3. | Systems Design with High-level Synthesis | Physical
(2 days) |
Penang | 29th & 30th July | |
| 4. | Chip Layout: Partitioning & Floorplanning Automation | Physical
(2 days) |
Penang | 3rd & 4th August | |
| 5. | Chip Layout: Placement & Routing (I) Automation | Physical
(2 days) |
Penang | 5th & 6th August | |
| 6. | Chip Layout: Routing (II) Automation to Timing Closure | Physical
(2 days) |
Penang | 13th & 14th August | |
| No. | Requirements | Details |
|---|---|---|
| 1. | Eligible Applicants | Semiconductor companies operating in Malaysia, with specialisation in the following technologies:
|
| 2. | Eligible Training Participants |
|
| 3. | Apprenticeship Placement Requirements |
The placement must be with a semiconductor company based in Malaysia and must be relevant to one or more of the following technology areas:
|
| 4. | Apprenticeship Structure |
|
| 5. | HRD Corp Claimable |
|
| No. | Technology Areas | Training Focus Areas |
|---|---|---|
| 1. | IC Design |
|
| 2. | Advanced Packaging |
|
| 3. | Wafer Fabrication |
|
| 4. | Embedded Systems |
|
| 5. | Process Automation |
|
Information in this section will be made available in due course.
| No. | Training Topic | Mode | Training Venue | Training Date | Brochure |
|---|---|---|---|---|---|
Documents in this section will be made available in due course.
Elevating Semiconductor Talent for Industry Excellence
| No. | Requirements | Details |
|---|---|---|
| 1. | Eligible Applicants | Semiconductor companies operating in Malaysia, with specialisation in the following technologies:
|
| 2. | Eligible Training Participants |
|
| 3. | Internship Placement Requirements |
The placement must be with a semiconductor company based in Malaysia and must be relevant to one or more of the following technology areas:
|
| 4. | Internship Structure |
|
| 5. | Internship Mode |
|
| 6. | Internship Period |
|
| 7. | HRD Corp Claimable |
|
| No. | Technology Areas | Training Focus Areas |
|---|---|---|
| 1. | IC Design |
|
| 2. | Advanced Packaging |
|
| 3. | Wafer Fabrication |
|
| 4. | Embedded Systems |
|
| 5. | Process Automation |
|
Information in this section will be made available in due course.
| No. | Training Topic | Mode | Training Venue | Training Date | Brochure |
|---|---|---|---|---|---|
Documents in this section will be made available in due course.
Elevating Semiconductor Talent for Industry Excellence
Specialised Tools and Equipment for Talent Development
Facilities are equipped to support hands-on training across key areas of the semiconductor value chain.
These tools and resources are essential in preparing talent with the technical skills needed to meet industry demands and global standards.
To ensure that training programmes under ETSI are aligned with industry standards and emerging technologies, shared facilities are equipped with specialised tools and equipment covering key areas of the semiconductor value chain. These resources enable hands-on, experiential learning and the development of industry-relevant competencies across the following focus areas:
Documents in this section will be made available in due course.
Elevating Semiconductor Talent for Industry Excellence
The Upskilling Grant for the Current Industry Workforce aims to enhance the skills of Malaysia’s workforce in the aerospace and medical devices sectors. This grant offers employees the opportunity to strengthen their competencies, ensuring they remain relevant to current industry demands while increasing their competitiveness in the job market. All trainings under this grant must be conducted and completed within 2024 and 2025.
| No. | Requirements | Details |
|---|---|---|
| 1. | Eligible Applicants | Aerospace and medical devices companies located in Malaysia and consisting of:
|
| 2. | Eligible Training Participants |
|
| 3. | Allowable Training Providers | Malaysian or overseas training providers which may include:
|
| No. | Technology Areas | Training Focus Areas |
|---|---|---|
| 1. | Research and Development |
|
| 2. | Manufacturing technology and automation |
|
| 3. | Quality Management System |
|
| 4. | Packaging & Sterilization |
|
| 5. | Regulatory, Standards and Compliance |
|
| 6. | Electronic Device History Records (eDHR) |
|
| 7. | Distribution and warehousing |
|
| 8. | Pre-market regulatory approval |
|
| 9. | Post-market surveillance |
|
| 10. | Product life cycle management |
|
| 11. | Sustainability and ESG |
|
| No. | Technology Areas | Training Focus Areas |
|---|---|---|
| 1. | Maintenance Repair Overhaul (MRO) |
|
| 2. | Manufacturing |
|
| 3. | System Integration |
|
| 4. | Engineering & Design |
|
| 5. | Continuing Airworthiness Management Organisation (CAMO) |
|
| 6. | Aerospace Support Services |
|
| 7. | Regulatory, Standards and Compliance |
|
| 8. | Avionics |
|
| Training Areas | Licensed Aircraft Engineers | Non-Destructive Testing (NDT) Level 3 | Quality Engineers/Inspectors | Aerospace welding technicians | Drone data analysts and engineers | Production equipment maintenance technicians | Workshop certifying staff |
|---|---|---|---|---|---|---|---|
| Level | Engineer | Technician | Technician & Engineers | Technician | Engineer | Technician | Technician |
| No. | Guidelines | Details |
|---|---|---|
| 1. | Types of training topics that can be carried out |
|
| 2. | Training Mode |
|
| 3. | Training Period |
|
| 4. | Training Cost Guideline |
|
| 5. | Participant Training Attendance |
|
| 6. | Application |
|
| 7. | Claim |
|
| 8. | Enquiry |
|
The Upskilling Grant for the Current Industry Workforce aims to enhance the skills of Malaysia’s workforce in the aerospace and medical devices sectors. This grant offers employees the opportunity to strengthen their competencies, ensuring they remain relevant to current industry demands while increasing their competitiveness in the job market. All trainings under this grant must be conducted and completed within 2024 and 2025.
| No. | Requirements | Details |
|---|---|---|
| 1. | Eligible Applicants | Aerospace and medical devices companies located in Malaysia and consisting of:
|
| 2. | Eligible Training Participants |
|
| 3. | Allowable Training Providers | Malaysian or overseas training providers which may include:
|
| No. | Technology Areas | Training Focus Areas |
|---|---|---|
| 1. | Research and Development |
|
| 2. | Manufacturing technology and automation |
|
| 3. | Quality Management System |
|
| 4. | Packaging & Sterilization |
|
| 5. | Regulatory, Standards and Compliance |
|
| 6. | Electronic Device History Records (eDHR) |
|
| 7. | Distribution and warehousing |
|
| 8. | Pre-market regulatory approval |
|
| 9. | Post-market surveillance |
|
| 10. | Product life cycle management |
|
| 11. | Sustainability and ESG |
|
| No. | Technology Areas | Training Focus Areas |
|---|---|---|
| 1. | Maintenance Repair Overhaul (MRO) |
|
| 2. | Manufacturing |
|
| 3. | System Integration |
|
| 4. | Engineering & Design |
|
| 5. | Continuing Airworthiness Management Organisation (CAMO) |
|
| 6. | Aerospace Support Services |
|
| 7. | Regulatory, Standards and Compliance |
|
| 8. | Avionics |
|
| Training Areas | Licensed Aircraft Engineers | Non-Destructive Testing (NDT) Level 3 | Quality Engineers/Inspectors | Aerospace welding technicians | Drone data analysts and engineers | Production equipment maintenance technicians | Workshop certifying staff |
|---|---|---|---|---|---|---|---|
| Level | Engineer | Technician | Technician & Engineers | Technician | Engineer | Technician | Technician |
| No. | Guidelines | Details |
|---|---|---|
| 1. | Types of training topics that can be carried out |
|
| 2. | Training Mode |
|
| 3. | Training Period |
|
| 4. | Training Cost Guideline |
|
| 5. | Participant Training Attendance |
|
| 6. | Application |
|
| 7. | Claim |
|
| 8. | Enquiry |
|
The Upskilling Grant for the Current Industry Workforce aims to enhance the skills of Malaysia’s workforce in the aerospace and medical devices sectors. This grant offers employees the opportunity to strengthen their competencies, ensuring they remain relevant to current industry demands while increasing their competitiveness in the job market. All trainings under this grant must be conducted and completed within 2024 and 2025.
| No. | Requirements | Details |
|---|---|---|
| 1. | Eligible Applicants | Aerospace and medical devices companies located in Malaysia and consisting of:
|
| 2. | Eligible Training Participants |
|
| 3. | Allowable Training Providers | Malaysian or overseas training providers which may include:
|
| No. | Technology Areas | Training Focus Areas |
|---|---|---|
| 1. | Research and Development |
|
| 2. | Manufacturing technology and automation |
|
| 3. | Quality Management System |
|
| 4. | Packaging & Sterilization |
|
| 5. | Regulatory, Standards and Compliance |
|
| 6. | Electronic Device History Records (eDHR) |
|
| 7. | Distribution and warehousing |
|
| 8. | Pre-market regulatory approval |
|
| 9. | Post-market surveillance |
|
| 10. | Product life cycle management |
|
| 11. | Sustainability and ESG |
|
| No. | Technology Areas | Training Focus Areas |
|---|---|---|
| 1. | Maintenance Repair Overhaul (MRO) |
|
| 2. | Manufacturing |
|
| 3. | System Integration |
|
| 4. | Engineering & Design |
|
| 5. | Continuing Airworthiness Management Organisation (CAMO) |
|
| 6. | Aerospace Support Services |
|
| 7. | Regulatory, Standards and Compliance |
|
| 8. | Avionics |
|
| Training Areas | Licensed Aircraft Engineers | Non-Destructive Testing (NDT) Level 3 | Quality Engineers/Inspectors | Aerospace welding technicians | Drone data analysts and engineers | Production equipment maintenance technicians | Workshop certifying staff |
|---|---|---|---|---|---|---|---|
| Level | Engineer | Technician | Technician & Engineers | Technician | Engineer | Technician | Technician |
| No. | Guidelines | Details |
|---|---|---|
| 1. | Types of training topics that can be carried out |
|
| 2. | Training Mode |
|
| 3. | Training Period |
|
| 4. | Training Cost Guideline |
|
| 5. | Participant Training Attendance |
|
| 6. | Application |
|
| 7. | Claim |
|
| 8. | Enquiry |
|
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