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ETSI for National Training Week 2026

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Engineering Talent For Semiconductor (ETSI)

for National Training Week 2026

In alignment with the National Semiconductor Strategic Plan (NSS), the development of local talent is a key pillar in driving the growth of the Electrical & Electronics (E&E) industry, with a particular focus on semiconductor technology. To meet the projected industry demand, the NSS targets the training of 60,000 engineers. In support of this objective, the Engineering Talent for Semiconductor Industry (ETSI) program has been established as a strategic talent development initiative to facilitate the effective implementation of the NSS. Further information on ETSI can be viewed at Engineering Talent for Semiconductor Industry (ETSI) website.

ETSI Trainings

for National Training Week (NTW)

20th till 24th July 2026

Advanced Packaging Trainings

Penang

ETSI for Current Workforce
July & August 2026

ETSI for National Training Week 2026
Elevating Semiconductor Talent for Industry Excellence

Training Registration is via https://www.nationaltrainingweek.gov.my/

ANNOUNCEMENT: Registration for ONLINE courses will be closed by 12pm, 25th July 2026.

You will be required to sign up on the NTW website and register for the training topics. Search for CREST NTW training courses using any of the following methods:

  1. Under Course Provider, search for COLLABORATIVE RESEARCH IN ENGINEERING, SCIENCE AND TECHNOLOGY CENTER.
  2. For specific courses, click the Course Link in the table below.

Note:

  • Training Brochures and Trainer’s Profile for each course is available at NTW website
  • Registered participants will receive an email containing the Microsoft Teams link for the online training prior to the start of the training.

No. Training Topic Training Date Training Time Course Registration
Advanced Packaging
1 From Sand to Silicon: Fundamentals of Semiconductor Wafer Fabrication 20th July 9.00am till 10.00am Completed
21st July 9.00am till 10.00am Completed
22nd July 9.00am till 10.00am Completed
23rd July 9.00am till 10.00am Completed
24th July 9.00am till 10.00am Completed
2 Beyond the Wafer: IC Packaging and the Future of Semiconductor Integration 20th July 11.00am till 12.00pm Completed
21st July 11.00am till 12.00pm Completed
22nd July 11.00am till 12.00pm Completed
23rd July 11.00am till 12.00pm Completed
24th July 11.00am till 12.00pm Completed
3 CoWoS (Chip on Wafer on Substrate) Technology and Advanced Integration 20th July 11.00am till 12.00pm Completed
21st July 11.00am till 12.00pm Completed
23rd July 11.00am till 12.00pm Completed
24th July 11.00am till 12.00pm Completed
25th July 11.00am till 12.00pm Completed
4 Introduction to Advanced Packaging: Technologies, Trends and Future Opportunities 20th July 9.00am till 10.00am Completed
21st July 9.00am till 10.00am Completed
23rd July 9.00am till 10.00am Completed
24th July 9.00am till 10.00am Completed
25th July 9.00am till 10.00am Completed
5 Overview of Advanced Packaging Technology: 3D IC and Heterogeneous Integration 20th July 9.00am till 10.00am Completed
21st July 9.00am till 10.00am Completed
6

What’s Next in Advanced Packaging? – From Hybrid Bonding to Glass Substrates and Beyond

 20th July 10.30am till 11.30am Completed
21st July 10.30am till 11.30am Completed
22nd July 10.30am till 11.30am Completed
7

Foundation and Overview of Advanced Packaging

 20th July 2.00pm till 3.00pm Completed
22nd July 9.00am till 10.00am Completed
8

Introduction to Reliability and Failure Modes in Advanced Semiconductor Packaging

 20th July 10.30am till 11.30am Completed
22nd July 10.30am till 11.30am Completed
23rd July 10.30am till 11.30am Completed
9

Sand to Microchip: Foundation and Overview of IC Packaging

 20th July 10.00am till 11.00am Completed
21st July 10.00am till 11.00am Completed
22nd July 10.00am till 11.00am Completed
23rd July 10.00am till 11.00am Completed
24th July 10.00am till 11.00am Completed
10

Overview of 2.5D IC Packaging & Thermal Management for HPC

 20th July 4.00pm till 5.00pm Completed
21st July 4.00pm till 5.00pm Completed
22nd July 4.00pm till 5.00pm Completed
23rd July 4.00pm till 5.00pm Completed
24th July 4.00pm till 5.00pm Completed
11

Introduction to Electronic Packaging & Polymer Materials in Electronic Packaging

 20th July 10.00am till 11.00am Completed
21st July 10.00am till 11.00am Completed
22nd July 10.00am till 11.00am Completed
23rd July 10.00am till 11.00am Completed
24th July 10.00am till 11.00am Completed
12

Electronic Packaging Processes & Reliability and Failure Mechanisms

 20th July 2.30pm till 3.30pm Completed
21st July 2.30pm till 3.30pm Completed
22nd July 2.30pm till 3.30pm Completed
23rd July 2.30pm till 3.30pm Completed
24th July 2.30pm till 3.30pm Completed
13

Understanding Mechanics of Materials for Better Electronic Packaging

 21st July 6.00pm till 7.00pm Completed
23rd July 6.00pm till 7.00pm Completed
25th July 4.00pm till 5.00pm Completed
14

Understanding Thermal Stress and Structural Reliability in Electronic Packages

 22nd July 6.00pm till 7.00pm Completed
24th July 6.00pm till 7.00pm Completed
25th July 6.00pm till 7.00pm Completed
15

The Science Behind Semiconductor Packaging: Assembly, Reliability and Failure Analysis

 22nd July 10.00am till 11.00am Completed
23rd July 10.00am till 11.00am Completed
24th July 10.00am till 11.00am Completed
15

Engineering Smarter Manufacturing: Artificial Intelligence and Simulation in Semiconductor Industry

 22nd July 3.00pm till 4.00pm Completed
23rd July 3.00pm till 4.00pm Completed
24th July 3.00pm till 4.00pm Completed

Training Registration is via https://www.nationaltrainingweek.gov.my/

ANNOUNCEMENT: Registration for Self-Paced/E-Learning courses will be closed by 12pm, 25th July 2026.

 

You will be required to sign up on the NTW website and register for the training topics. Search for CREST NTW training courses using any of the following methods:

  1. Under Course Provider, search for COLLABORATIVE RESEARCH IN ENGINEERING, SCIENCE AND TECHNOLOGY CENTER.
  2. For specific courses, click the Course Link in the table below.

Note:

  • Training Brochures and Trainer’s Profile for each course is available at NTW website
  • Registered participants will receive an email containing the course module link prior to the start of the training.
No. Training Topic Training Date Course Registration
Advanced Packaging
1. Overview of Advanced Packaging Technology: 3D IC and Heterogeneous Integration 21st till 26th July Closed
2. What’s Next in Advanced Packaging? – From Hybrid Bonding to Glass Substrates and Beyond 21st till 26th July Closed
3. ANSYS Mechanical Basics: Quick Dive Into Electromigration Simulation 20th till 26th July Closed
4. Fundamentals of Electromigration in Semiconductor Advanced Packaging 20th till 26th July Closed
5. Keeping Chips Cool: An Introduction to Thermal Interface Materials (TIMs) for Advanced Packaging 20th till 26th July Closed
6. Thermal Interface Materials (TIMs): Characterisation of Nanostructured TIMs for Advanced Packaging 20th till 26th July Closed
7. Advanced Packaging Technologies Overview: Flip-Chip, WLP, and SiP 20th till 26th July Closed
8. Reliability Testing Frameworks for Fan Out 20th till 26th July Closed
9. Failure Analysis and Reliability Challenges in Advanced Semiconductor Packaging 20th till 26th July Closed
10. Unlocking the Future of Semiconductor Packaging through 3D IC Integration 20th till 26th July Closed
11. Foundation and Overview of Advanced Packaging 20th till 26th July Closed
12. Introduction to Reliability and Failure Modes in Advanced Semiconductor Packaging 20th till 26th July Closed
13. Preparation of Semiconductor Materials 20th till 26th July Closed
14. Silicon Wafer Manufacturing 20th till 26th July Closed
15. Understanding Mechanics of Materials for Better Electronic Packaging 20th till 26th July Closed
16. Understanding Thermal Stress and Structural Reliability in Electronic Packages 20th till 26th July Closed
17. Solder Interconnect to Direct Cu-Cu Bonding : The Challenges 20th till 26th July Closed
18. Failures in Interconnect:Understanding Fracture and Failure Mechanism 20th till 26th July Closed
19. Failure Modes in Semiconductor Packaging 20th till 26th July Closed
20. JEDEC Standards in Reliability Testing 20th till 26th July Closed
21. Sand to Microchip: Foundation and Overview of IC Packaging 20th till 26th July Closed
22. Overview of 2.5D IC Packaging & Thermal Management for HPC 20th till 26th July Closed
23. The Science Behind Semiconductor Packaging: Assembly, Reliability and Failure Analysis 20th till 26th July Closed
24. Engineering Smarter Manufacturing: Artificial Intelligence and Simulation in Semiconductor Industry 20th till 26th July Closed
25. CoWoS (Chip on Wafer on Substrate) Technology and Advanced Integration 20th till 26th July Closed
26. Introduction to Advanced Packaging: Technologies, Trends and Future Opportunities 20th till 26th July Closed
27. Beyond Packaging: Testing Challenges in Advanced Semiconductor Packaging 20th till 26th July Closed
28. Chiplets & Heterogeneous Integration: The Future Beyond Moore’s Law 20th till 26th July Closed
29. Introduction to Thermal Management of Advanced Semiconductor Packaging 20th till 26th July Closed
30. Thermal Analysis and Cooling Solutions in Advanced Semiconductor Packaging 20th till 26th July Closed
31. Semiconductor Assembly & Testing 20th till 26th July Closed
32. Maintenance in Semiconductor Industry 20th till 26th July Closed
33. Failure Analysis and Reliability Challenges in Semiconductor Packaging- Phase 1 20th till 26th July Closed
34. Failure Analysis and Reliability Challenges in Semiconductor Packaging- Phase 2 20th till 26th July Closed

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